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Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

M. Y. Tsai, T. C. Kuo
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
DOI: https://doi.org/10.1115/1.4056717
Published Online: February 8, 2023
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Topics: Bending strength, Silicon, Stress, Displacement, Failure mechanisms
Journal Articles

Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test

M. Y. Tsai, H. Y. Liu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031002.
Paper No: EP-20-1125
DOI: https://doi.org/10.1115/1.4051256
Published Online: September 15, 2021
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Topics: Bending strength, Silicon, Stress, Fittings, Deflection
Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
DOI: https://doi.org/10.1115/1.4044961
Published Online: October 18, 2019
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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness
Proceedings Papers

Thermal Reliability of Low-Cost High-Power LED Package Module Under WHTOL Test

C. H. Chen, W. L. Tsai, C. Y. Tang, M. Y. Tsai
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 921-927, July 19–23, 2009
Paper No: InterPACK2009-89337
DOI: https://doi.org/10.1115/InterPACK2009-89337
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Topics: Junctions, Reliability, Temperature, Thermal resistance
Proceedings Papers

An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging

M. Y. Tsai, C. Y. Huang, C. Y. Chiang, C. Y. Wu, S. S. Yang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 711-717, July 8–12, 2007
Paper No: IPACK2007-33967
DOI: https://doi.org/10.1115/IPACK2007-33967
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Topics: Adhesives, Diffusion (Physics), Electronic packaging, Temperature, Shrinkage (Materials), Stress, Finite element methods, Relaxation (Physics), Design, Hardening (Curing)
Proceedings Papers

Novel Test Methods for Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 939-945, July 17–22, 2005
Paper No: IPACK2005-73296
DOI: https://doi.org/10.1115/IPACK2005-73296
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Topics: Atomic force microscopy, Design, Electromagnetic scattering, Electronic packaging, Failure, Failure mechanisms, Finite element analysis, Geometry, Grinding, Packaging
Journal Articles

Test Methods for Silicon Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
DOI: https://doi.org/10.1115/1.2351907
Published Online: February 6, 2006
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Topics: Silicon, Stress, Semiconductor wafers, Failure, Surface roughness, Deflection, Finite element analysis
Journal Articles

A Note on Suhir’s Solution of Thermal Stresses for a Die-Substrate Assembly

M. Y. Tsai, C. H. Hsu, C. N. Han
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 115–119.
DOI: https://doi.org/10.1115/1.1648056
Published Online: April 30, 2004
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Topics: Manufacturing, Stress, Thermal stresses, Warping, Finite element analysis, Shear (Mechanics), Deformation