1-7 of 7
Minfu Lu
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Zhengfang Qian, Minfu Lu, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 377-382, November 16–21, 1997
Paper No: IMECE1997-1113
DOI: https://doi.org/10.1115/IMECE1997-1113
View Paper
PDF
Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects
Proceedings Papers

Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester

Zhengfang Qian, Minfu Lu, Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 105-112, November 16–21, 1997
Paper No: IMECE1997-1234
DOI: https://doi.org/10.1115/IMECE1997-1234
View Paper
PDF
Topics: Modeling, Polymer films, Testing, Thermomechanics, Nylon film
Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997
Paper No: IMECE1997-1237
DOI: https://doi.org/10.1115/IMECE1997-1237
View Paper
PDF
Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing
Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997
Paper No: IMECE1997-1227
DOI: https://doi.org/10.1115/IMECE1997-1227
View Paper
PDF
Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation
Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997
Paper No: IMECE1997-0505
DOI: https://doi.org/10.1115/IMECE1997-0505
View Paper
PDF
Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density
Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998
Paper No: IMECE1998-0429
DOI: https://doi.org/10.1115/IMECE1998-0429
View Paper
PDF
Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers
Proceedings Papers

A Linear Motor Driven Mini Tester and its Application to Thermal/Mechanical Fatigue Testing of Solder Joint Specimen

Minfu Lu, Zhengfang Qian, Sheng Liu, Jianhau Wu
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 43-49, November 15–20, 1998
Paper No: IMECE1998-0427
DOI: https://doi.org/10.1115/IMECE1998-0427
View Paper
PDF
Topics: Fatigue testing, Linear motors, Solder joints, Fatigue, Damage, Engines, Motors, Solders, Failure, Fracture (Materials)