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Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011102.
Paper No: EP-22-1016
DOI: https://doi.org/10.1115/1.4055394
Published Online: September 27, 2022
View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
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Topics: Anodes, Creep, Current density, Electrodiffusion, Solder joints, Stress, Temperature
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021
Paper No: IPACK2021-69882
DOI: https://doi.org/10.1115/IPACK2021-69882
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
Open the PDF for Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model in another window
Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
DOI: https://doi.org/10.1115/1.4052231
Published Online: September 13, 2021
View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model
Open the PDF for Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model in another window
Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress
Proceedings Papers

Fatigue Life Law Based on Inelastic Strain Energy Density of Solder Alloys and its Simple Prediction Method

Tomoya Fumikura, Mitsuaki Kato, Takahiro Omori
Proc. ASME. IMECE2020, Volume 12: Mechanics of Solids, Structures, and Fluids, V012T12A015, November 16–19, 2020
Paper No: IMECE2020-23675
DOI: https://doi.org/10.1115/IMECE2020-23675
View Paper titled, Fatigue Life Law Based on Inelastic Strain Energy Density of Solder Alloys and its Simple Prediction Method
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Topics: Alloys, Density, Fatigue life, Solders
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020
Paper No: IPACK2020-2556
DOI: https://doi.org/10.1115/IPACK2020-2556
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model
Open the PDF for Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model in another window
Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Proceedings Papers

Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. IMECE2019, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T12A005, November 11–14, 2019
Paper No: IMECE2019-10558
DOI: https://doi.org/10.1115/IMECE2019-10558
View Paper titled, Electromigration Analysis of Power Modules by Electrical-Thermal-Mechanical Coupled Model
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Topics: Bonding, Electrodiffusion, Wire
Journal Articles

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori
Journal: Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
Article Type: Research-Article
ASME J Nondestructive Evaluation. August 2018, 1(3): 031004–031004-12.
Paper No: NDE-17-1105
DOI: https://doi.org/10.1115/1.4039938
Published Online: May 3, 2018
View Article titled, Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
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Topics: Circuits, Cycles, Failure, Fatigue, Fatigue failure, Solder joints, Stress, Fatigue life
Proceedings Papers

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

Kenji Hirohata, Yousuke Hisakuni, Takahiro Omori, Tomoko Monda, Minoru Mukai
Proc. ASME. IMECE2013, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T11A082, November 15–21, 2013
Paper No: IMECE2013-65317
DOI: https://doi.org/10.1115/IMECE2013-65317
View Paper titled, Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit
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Topics: Circuits, Fatigue failure, Printed circuit boards, Solder joints, Ball-Grid-Array packaging, Stress, Density, Failure, Packaging, Probability
Proceedings Papers

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Paper No: IPACK2013-73161
DOI: https://doi.org/10.1115/IPACK2013-73161
View Paper titled, Large-Scale Damage Path Simulation for Solder Joints in a BGA Package
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Topics: Ball-Grid-Array packages, Damage, Simulation, Solder joints, Fatigue, Crack propagation, Electronic packages, Fatigue life, Modeling, Printed circuit boards
Proceedings Papers

Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards

Kenji Hirohata, Katsumi Hisano, Yousuke Hisakuni, Takahiro Omori, Minoru Mukai
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 469-478, November 12–18, 2010
Paper No: IMECE2010-37988
DOI: https://doi.org/10.1115/IMECE2010-37988
View Paper titled, Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards
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Topics: Cooling, Printed circuit boards, Stress, Temperature, Computer-aided engineering, Deformation, Electronic equipment, Reliability, Design, Design methodology