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William Infantolino
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Journal Articles

An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages

Sushma Madduri, William Infantolino, Bahgat.G Sammakia
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011007.
https://doi.org/10.1115/1.4005911
Published Online: March 19, 2012
View Article titled, An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages
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Topics: Epoxy adhesives, Epoxy resins, Temperature, Temperature effects, Stress analysis (Engineering)
Journal Articles

Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011008.
https://doi.org/10.1115/1.4005910
Published Online: March 19, 2012
View Article titled, Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment
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Topics: Condensation, Lasers, Temperature, Cycles
Proceedings Papers

Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment

Sushma Madduri, Bahgat G. Sammakia, William Infantolino, Satish C. Chaparala, Lawrence C. Hughes, J. Micheal Harris
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 665-671, July 19–23, 2009
Paper No: InterPACK2009-89115
https://doi.org/10.1115/InterPACK2009-89115
View Paper titled, Performance Study of a GaAs Based Laser Diode Chip in a Condensing Environment
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Topics: Condensation, Gallium arsenide, Lasers
Proceedings Papers

Moisture Concentration and Temperature Dependence of the Coefficient of Hygroscopic Swelling (CHS)

Sushma Madduri, William Infantolino, Bahgat G. Sammakia, Seungbae Park, Haojun Zhang, Satish C. Chaparala
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 279-285, November 13–19, 2009
Paper No: IMECE2009-12243
https://doi.org/10.1115/IMECE2009-12243
View Paper titled, Moisture Concentration and Temperature Dependence of the Coefficient of Hygroscopic Swelling (CHS)
Open the PDF for Moisture Concentration and Temperature Dependence of the Coefficient of Hygroscopic Swelling (CHS) in another window
Topics: Temperature effects, Epoxy adhesives, Epoxy resins, Temperature, Adhesives, Computation, Computational methods, Failure, Interferometry, Modeling