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William Maltz
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Proceedings Papers

Real Time Prediction of Li-Ion Battery Pack Temperatures in EV Vehicles

Azita Soleymani, William Maltz
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 27–29, 2020
Paper No: IPACK2020-2609
https://doi.org/10.1115/IPACK2020-2609
View Paper titled, Real Time Prediction of Li-Ion Battery Pack Temperatures in EV Vehicles
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Topics: Lithium-ion batteries, Temperature, Vehicles
Proceedings Papers

On the Thermal Management Challenges in Next Generation Handheld Devices

Guy R. Wagner, William Maltz
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A046, July 16–18, 2013
Paper No: IPACK2013-73237
https://doi.org/10.1115/IPACK2013-73237
View Paper titled, On the Thermal Management Challenges in Next Generation Handheld Devices
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Topics: Thermal management, Cooling, Energy dissipation, Computers, Flat heat pipes, Laptop computers, Shells, Temperature
Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011003.
https://doi.org/10.1115/1.4003217
Published Online: March 3, 2011
View Article titled, Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection
Proceedings Papers

Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 741-751, July 19–23, 2009
Paper No: InterPACK2009-89092
https://doi.org/10.1115/InterPACK2009-89092
View Paper titled, Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
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Topics: Boundary-value problems, Heat, Construction, Design, Errors, Flow (Dynamics), Junctions, Matlab, Natural convection, Optimization
Journal Articles

Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study

Arun P. Raghupathy, Urmila Ghia, Karman Ghia, William Maltz
Journal: Journal of Heat Transfer
Article Type: Technical Briefs
J. Heat Transfer. June 2010, 132(6): 064502.
https://doi.org/10.1115/1.4000945
Published Online: April 1, 2010
View Article titled, Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study
Open the PDF for Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study in another window
Topics: Boundary-value problems, Computational fluid dynamics, Finite volume methods, Heat, Heat transfer, Modeling, Temperature, Transients (Dynamics)