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Research Papers

J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021001. doi: https://doi.org/10.1115/1.4041492
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021002. doi: https://doi.org/10.1115/1.4041491
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021003. doi: https://doi.org/10.1115/1.4041597
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021004. doi: https://doi.org/10.1115/1.4041348
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021005. doi: https://doi.org/10.1115/1.4041493
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021006. doi: https://doi.org/10.1115/1.4041439
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021007. doi: https://doi.org/10.1115/1.4041441
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021008. doi: https://doi.org/10.1115/1.4041596
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021009. doi: https://doi.org/10.1115/1.4041595
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021010. doi: https://doi.org/10.1115/1.4041804
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021011. doi: https://doi.org/10.1115/1.4041440
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021012. doi: https://doi.org/10.1115/1.4041635
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021013. doi: https://doi.org/10.1115/1.4041873
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021014. doi: https://doi.org/10.1115/1.4041937
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021015. doi: https://doi.org/10.1115/1.4041793
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021016. doi: https://doi.org/10.1115/1.4041684

Technical Briefs

J. Thermal Sci. Eng. Appl. April 2019, 11(2): 024501. doi: https://doi.org/10.1115/1.4041598
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 024502. doi: https://doi.org/10.1115/1.4041594
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 024503. doi: https://doi.org/10.1115/1.4041636
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 024504. doi: https://doi.org/10.1115/1.4041682
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